An exemplary method of forming an attenuating extreme ultraviolet (EUV) phase-shifting mask (60) can include providing a multi-layer mirror (34) over an integrated circuit substrate (32) or a mask blank, providing a buffer layer (36) over the multi-layer mirror (34), providing a dual element material layer (38, 40) over the buffer layer (36), and selectively growing feature (66) on the integrated circuit substrate (32) or mask blank using a photon assisted chemical vapor deposition (CVD) process when depositing the dual element layer (38, 40).

An exemplary method of forming an attenuating extreme ultraviolet (EUV) phase-shifting mask is described. This method can include providing a multi-layer mirror over an integrated circuit substrate or a mask blank, providing a buffer layer over the multi-layer mirror, providing a dual element material layer over the buffer layer, and selectively growing features on the integrated circuit substrate or mask blank using a photon assisted chemical vapor deposition (CVD) process when depositing the dual element layer.

An exemplary method of selectively patterning a hard mask or reticle using a laser to cause deposition of hard mask material in locations forming the hard mask pattern. This method can include providing a vapor in a vapor chamber containing an integrated circuit substrate, and applying a laser to selected areas of the integrated circuit substrate to cause a reaction with the vapor and create a structure on the integrated circuit substrate.