| Description |
Using its Automated Precision Manufacturing (APM) system, AMD has taken the critical step from its 130 nanometers (nm) Silicon On Insulator (SOI) process to a 90nm SOI.Lithography is the printing process used to manufacture processors. When we say we manufacture a device at 90 nanometers (nm), that number corresponds to the International Technology Roadmap for Semiconductors’ (ITRS) definition of the minimum metal pitch – the smallest metal lines – used. These tiny proportions allow AMD to etch onto a silicon die complex circuits of millions upon millions of transistors, which allow for more-powerful-but-smaller processors. AMD uses a combination of 248nm and 193nm lithography tools, along with resolution enhancement techniques, to etch sub-50nm transistor gates – the smaller transistors switch faster and draw less power.
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