A method of manufacturing a semiconductor wafer, the method comprising: providing a base wafer comprising a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of said metal layers, wherein said monocrystalline layer comprises second alignment marks; and performing a lithography using an alignment based on a misalignment between said first alignment marks and said second alignment marks.

A semiconductor device comprising power distribution wires wherein; a portion of said wires have thermal connection to the semiconductor layer and said thermal connection designed to conduct heat but to not conduct electricity.

A method of manufacturing semiconductor wafers, the method including: providing a donor wafer including a semiconductor substrate; performing a lithography step and processing the donor wafer; and performing at least two subsequent steps of layer transfer out of the donor wafer, each layer transfer step producing a transferred layer, where each of the transferred layers had been affected by the lithography step, and where each of the transferred layer includes a plurality of transistors with side gates, and where the layer transfer includes an ion-cut, the ion-cut including an ion implant thru the transistors.

A semiconductor device includes a first mono-crystallized semiconductor layer; and a second mono-crystallized semiconductor layer; wherein said first and second mono-crystallized semiconductor layers are overlaying one on top of the other, and wherein said first mono-crystallized semiconductor layer comprise repeating memory structure with sub structures defined by etching.

An integrated circuit including a first layer of logic circuits, and a second layer of logic circuits overlaying the first layer, wherein the first layer includes a multiplicity of flip-flops wherein each of the flip-flops has at least one connection to the second layer, and wherein the second layer includes at least one logic circuit with inputs including the connection and with at least one output connected to the first layer.

A semiconductor device includes a first transistor layer and a second transistor layer overlaying the first transistor layer, wherein said first transistor layer comprises a plurality of flip-flops each having a selectively coupleable additional input generated by said second transistor layer.

A three dimensional semiconductor device is described with two transistor layers overlaid. The first transistor layer comprises a plurality of flip-flops each having an input and an output, wherein the inputs are selectively coupleable to the second transistor layer.

A three dimensional semiconductor device includes a first die; and a second die overlaying the first die, wherein said first die comprises signals are selectively coupleable to the second die using Through Silicon Vias.

A method to fabricate a semiconductor device, including the sequence of: implanting one or more regions on a semiconductor wafer forming a doped layer; performing a first transfer of the doped layer onto a carrier; and then performing a second transfer of the doped layer from the carrier to a target wafer; and then etching said one or more regions of the doped layer to form transistors on the doped layer.