Showing 51-60 of 36,058 items.
NameSectorAbstractYear AppliedYear GrantedAuthority
INORGANIC NANOPOROUS PARTICLES WITH WATER DISPERSIBLE POLYURETHANE BINDER

Construction

2010_____EP
Aqueous hybrid binder for jointing mortars

Construction

Producing jointing mortars, comprises obtaining copolymers of ethylenically unsaturated monomers and ethylenically functionalized nanoparticles in the form of their aqueous polymer dispersions or water-redispersible polymer powder by radically initiated polymerization...
Producing jointing mortars, comprises obtaining copolymers of ethylenically unsaturated monomers and ethylenically functionalized nanoparticles in the form of their aqueous polymer dispersions or water-redispersible polymer powder by radically initiated polymerization in an aqueous medium, and optionally subsequently drying the resulting polymer dispersion. Producing jointing mortars, comprises obtaining copolymers of ethylenically unsaturated monomers and ethylenically functionalized nanoparticles in the form of their aqueous polymer dispersions or water-redispersible polymer powder by radically initiated polymerization in an aqueous medium, and optionally subsequently drying the resulting polymer dispersion of (A) one or more monomers comprising vinyl esters, (meth)acrylic acid esters, vinyl aromatics, olefins, 1,3-dienes, vinyl ethers and vinyl halides, and optionally further monomers copolymerizable with them, in the presence of (B) at least one particle-P having an average diameter of = 1000 nm, which is functionalized with ethylenically unsaturated, radically polymerizable groups, where: the component (B) contains (B1) metal oxides or semimetal oxides, and/or (B2) silicone resins that are produced from silicon group-containing repeating units of formula (R4 ( p + z )SiO ( 4 - p -z ) / 2) (II); and the components (B1) and (B2) are functionalized with one or more alpha -organosilane compounds of formula ((R1O) 3 - n(R2) nSi-(CR3 2)-X) (I). R4 : H or hydroxy, or 1-18C-alkyl, -cycloalkyl, -aryl, -alkoxy or -aryloxy (all optionally substituted), where p+z is = 0-3 for at least 20 mol% of the respective silicone resin; R1 : H, 1-6C-alkyl or aryl; R2, R3 : H, 1-12C-alkyl or aryl; n : 0-2; and X : 2-20C-hydrocarbon radical having an ethylenically unsaturated group. An independent claim is included for the jointing mortars obtained by the process.
20112013EP
Image generating device with improved illumination efficiency

Construction

An image generating device (200) includes a light source (210), a light filtering element (220, 220D), a light conversion element (260, 260A, 260B, 260C, 260D), and an image generating element...
An image generating device (200) includes a light source (210), a light filtering element (220, 220D), a light conversion element (260, 260A, 260B, 260C, 260D), and an image generating element (240) . The light source is for generating visible light. The light filtering element is disposed on a light path of the visible light. The light filtering element includes a plurality of light filtering blocks (222, 224, 226, 222D, 224D, 226D, 228D), and each of the light filtering blocks is for allowing light with wavelengths within a predetermined range to pass through. The light conversion element is disposed on the light path. The light conversion element includes a first quantum dot layer (262A, 262B, 262C, 262D) for converting light with wavelength below a first wavelength to light with the first wavelength. The image generating element is for generating images according to light passed through the light filtering element and the light conversion element.
2011_____EP
Image generating device with improved illumination efficiency

Construction

An image generating device which (600) includes a first light source, a light conversion element, and an image generating element (620). The first light source is for generating light with...
An image generating device which (600) includes a first light source, a light conversion element, and an image generating element (620). The first light source is for generating light with a first wavelength. The light conversion element is disposed on a light path of the light with the first wavelength. The light conversion element includes a first quantum dot layer for converting light with wavelengths under a second wavelength to light with the second wavelength, and a second quantum dot layer for converting light with wavelengths under a third wavelength to light with the third wavelength. The first wavelength is smaller than the second wavelength, and the second wavelength is smaller than the third wavelength. The image generating element is for generating images according to light transmitted from the light conversion element.
2011_____EP
Metal-ceramic substrate and method for manufacturing such a substrate

Construction

The metal-ceramic substrate comprises a first outer metal layer (4) forming a first surface side of the metal-ceramic substrate, and a second outer metal layer (5) forming a second surface...
The metal-ceramic substrate comprises a first outer metal layer (4) forming a first surface side of the metal-ceramic substrate, and a second outer metal layer (5) forming a second surface side of the metal-ceramic substrate. The outer metal layers are connected by flat bonding with the surface sides of a plate-shaped substrate body, which consists of two ceramic layers (2) to obtain improved mechanical, thermal and electrical properties and a single intermediate layer (3) spaced apart form the ceramic layer. The metal-ceramic substrate comprises a first outer metal layer (4) forming a first surface side of the metal-ceramic substrate, and a second outer metal layer (5) forming a second surface side of the metal-ceramic substrate. The outer metal layers are connected by flat bonding with the surface sides of a plate-shaped substrate body, which consists of two ceramic layers (2) to obtain improved mechanical, thermal and electrical properties and a single intermediate layer (3) spaced apart form the ceramic layer. The intermediate layer: forms an inner metal layer (3.1); is connected with the ceramic layer; is arranged between the ceramic layers; and extends itself over the total surface side of the ceramic layers adjoining the intermediate layer. A layer thickness of the intermediate layer is greater than the layer thickness of the outer metal layer and/or the thickness of one of the ceramic layers. The intermediate layer is formed with two inner metal layers and/or one of the inner metal layers and an inner insulating layer having an inner ceramic layer. The inner layers forming the intermediate layer are connected together by the flat bonding. The intermediate layer is formed with: the inner insulating layer arranged between the two inner metal layers; and a recess for forming a channel or a chamber for receiving released gas- and/or vaporous and/or liquid components during the bonding. The recess is opened at a circumferential side of the metal-ceramic substrate. The intermediate layer comprises two inner metal layers that are provided in one of the metal layers and the recess. The recess and/or its inner space are opened at a side of the inner metal layer on which the inner metal layer is connected with a further layer to the intermediate layer. The recess and/or its inner space of the adjacent ceramic layer are separated by a bottom forming the inner metal layer. The metal-ceramic substrate comprises a breaking strength, which is greater than the breaking strength of an individual ceramic layer whose layer thickness is equal to the sum of the layer thickness of the two ceramic layers spaced apart through the intermediate layer. The metal layer forming the intermediate layer or its material has a Brinell hardness of less than 40. The inner metal layers forming the intermediate layer are connected with an adhesive- or peel strength of greater than 10 N/mm with each adjacent ceramic layer. A plated through-hole is provided into the ceramic layers spaced apart from one another, where the through-hole connects the outer metal layer arranged on the ceramic layer or a metal layer region of the outer metal layer is mechanically, thermally and/or electrically connected with the inner metal layer. The metal-ceramic substrate comprises a voltage- or dielectric-strength of 18 kV/mm. A connection between the adjacent layers is produced by direct copper bond-bonding and/or active soldering and/or hard soldering and/or using polymer- or epoxy resin-based adhesives, with fibers and/or using an electrically conductive adhesive. An independent claim is included for a method for producing a metal-ceramic substrate.
2011_____EP
Granulate compound on the basis of pigment-coated carrier media, method for producing same and use

Construction

Surface of carrier particles is uniformly coated with at least one binder (2-40 %mass) in fluidized bed process, and with at least one colored or white pigment (2-20 %mass) to...
Surface of carrier particles is uniformly coated with at least one binder (2-40 %mass) in fluidized bed process, and with at least one colored or white pigment (2-20 %mass) to obtain colored or white granules.
2011_____EP
GLASS SUBSTRATE LIGHT EMITTING ELEMENT AND METHODS FOR MANUFACTURING AND LUMINESCENCE THEREOF

Construction

A light emitting element (10) is provided, which includes luminescent glass (13), a metal layer (14) formed on the surface of the luminescent glass (13), wherein periodic micro and nano...
A light emitting element (10) is provided, which includes luminescent glass (13), a metal layer (14) formed on the surface of the luminescent glass (13), wherein periodic micro and nano structure is provided on the metal layer (14), and the chemical constituent of the luminescent glass (13) is rare-earth-ion doped silicate. Further provided are manufacturing and luminescence methods of the light emitting element. The luminescent glass (13) in the present invention includes a metal layer (14) with periodic micro and nano structure, which can enhance the luminous efficiency and luminous homogeneity and stability of the luminescent glass, and can be used on superluminescent and high-speed operating light emitting devices.
2010_____EP
NANOMATERIAL HAVING TUNABLE INFRARED ABSORPTION CHARACTERISTICS AND ASSOCIATED METHOD OF MANUFACTURE

Construction

2011_____EP
LIGHTWEIGHT HEAT SINKS AND LED LAMPS EMPLOYING SAME

Construction

2011_____EP
Synthetic quartz glass substrate and making method

Construction

A synthetic quartz glass substrate has a surface of 6 inch squares including a central surface area of 132 mm squares. The central surface area of 132 mm squares has...
A synthetic quartz glass substrate has a surface of 6 inch squares including a central surface area of 132 mm squares. The central surface area of 132 mm squares has a flatness of up to 50 nm. A frame region obtained by subtracting the central surface area of 132 mm squares from the central surface area of 148 mm squares has a flatness of up to 150 nm.
2011_____EP