The growing importance of nanotechnology for the European Research Area is reflected in the FP6 Thematic Priorities. It is foreseen that most of the projects submitted to the Priority Area 3 (NMP) will need and develop nanopatterning techniques in one way or another. The Emerging Nanopatterning Methods (NaPa) consortium integrates the new patterning methods into one project, both anticipating and responding to the increasing need for technologies, standards and metrology required to harness the new application-relevant properties of engineered structures with nm-scale features. The NaPa consortium complements the deep UV technology by providing low-cost scalable processes and tools to cover the needs of nanopatterning from CMOS back-end processes through photonics to biotechnology. To achieve this, research in three technology strands is proposed: nanoimprint lithography, soft lithography & self-assembly and MEMS-based nanopatterning. While the former is at a crucial embryonic stage, requiring prompt consolidation to yield its first products in one or two years, the other two will result in applications towards the end of the project. Research in three overarching themes required by all strands: Materials, Tools and Simulation will be undertaken. NaPa brings together 35 leading academic and industrial European institutions with a vast amount of recent know-how on nanofabrication, partly developed within FP5. In total, 3500 person months will be contributed by the partners to the project. Complementing R&D, the consortium will design exciting nanoscience and nanoengineering courses to advance the training of the next generation of scientists and engineers and to create a positive attitude towards science among young people. Dissemination activities towards the lay public and sectors underrepresented in nanotechnology form an integral part in NaPa. Thus, NaPa offers a unique opportunity to unleash the potentials of #

The goal of IFOX is to explore, create and control novel electronic and magnetic functionalities, with focus on interfaces, in complex transition metal oxide heterostructures to develop the material platform for novel ‘More than Moore’ (MtM) and ‘beyond CMOS’ electronics, VLSI integratable with performance and functionality far beyond the state-of-the-art. To this end it will:

To extend beyond existing limits in nanodevice fabrication, new and unconventional lithographic technologies are necessary to reach Single Nanometer Manufacturing (SNM) for novel ‘Beyond CMOS devices’. Two approaches are considered: scanning probe lithography (SPL) and focused electron beam induced processing (FEBIP). Our project tackles this challenge by employing SPL and FEBIP with novel small molecule resist materials. The goal is to work from slow direct-write methods to high speed step-and-repeat manufacturing by Nano Imprint Lithography (NIL), developing methods for precise generation, placement, metrology and integration of functional features at 3 - 5 nm by direct write and sub-10nm into a NIL-template. The project will first produce a SPL-tool prototype and will then develop and demonstrate an integrated process flow to establish proof-of-concept ‘Beyond CMOS devices’ employing developments in industrial manufacturing processes (NIL, plasma etching) and new materials (Graphene, MoS2). By the end of the project: (a) SNM technology will be used to demonstrate novel room temperature single electron and quantum effect devices; (b) a SNM technology platform will be demonstrated, showing an integrated process flow, based on SPL prototype tools, electron beam induced processing, and finally pattern transfer at industrial partner sites. An interdisciplinary team (7 Industry and 8 Research/University partners) from experienced scientists will be established to cover specific fields of expertise: chemical synthesis, scanning probe lithography, FEBIP-Litho, sub-3nm design and device fabrication, single nanometer etching, and Step-and-Repeat NIL- and novel alignment system design. The project coordinator is a University with great experience in nanostructuring and European project management where the executive board includes European industry leaders such as IBM, IMEC, EVG, and Oxford Instruments.

Micro- and nanometer structuring has proven to be an efficient method to functionalize surfaces, and is attractive to manufacturers of plastic products. Plastic components are volume manufactured by injection moulding. Compact Discs and Digital Video Discs are today manufactured with nanometer range lateral resolution but, only on planar surfaces. Free-form (double-curved) moulding tools today offer resolutions down to 100 μm, limited by the methods used for creating the injection moulding tools. The objective of the project is to upgrade existing injection moulding production technology for manufacture of plastic components by enhancing the lateral resolution on free-form surfaces down to micro- and nanometer length scales. This will be achieved through the development of a complete nanoimprint lithography solution for structuring the free-form surface of injection moulding tools and tool inserts. This will enable a cost effective and flexible nanoscale manufacturing process that can easily be integrated with conventional mass production lines. The proposed technology enables functionality of plastic surfaces by topography instead of chemistry. This will significantly simplify the introduction of new products to the market, safer to produce and use. The proposed technology allows production of plastic surfaces with several different functionalities using the same material. This simplifies recycling and supports a cradle-to-cradle production philosophy. The proposed technology will be developed to meet specific industry demands from partners representing the plastic industry including the automotive, lighting and toy industries. During the project the European Trade Organisation representing the European plastic industry will disseminate the PLAST4FUTURE technology towards inter-sectoral end-users. An OEM service, provided by participating SMEs and Large Enterprises, will be established to secure a lasting value supporting European competitive strength.

In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now the driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool price plays also an important role in the overall cost of ownership of this technique. This trend opens opportunities for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developed by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments…_x000d_

DOTFIVE is a three-year IP proposal for a very ambitious project focused on advanced RTD activities necessary to move the Silicon/germanium heterojunction bipolar transistor (HBT) into the operating frequency range of 0.5 terahertz (THz) (500 gigahertz GHz) enabling the future development of communication, imaging or radar Integrated Circuits (IC) working at frequencies up to 160 GHz . For a given lithography node bipolar transistors and more recently HBT have always lead the frequency race compared to MOS devices, while offering higher power density and better analogue performances (transconductance, noise, transistor matching).The main objective of this highly qualified consortium is to establish a leadership position for the European semiconductor industry in the area of millimeter wave (mmW) by research and development work on silicon based transistor devices and circuit design capabilities and know-how. SiGe HBT is a key reliable device for applications requiring power > few mW (future MOS limitation) and enabling high density, low cost integration compared to III-V. To achieve the goal DOTFIVE unites a powerful consortium:

The core concept of the ThermoMag project revolves around developing and delivering new energy-harvesting thermoelectric materials and proof-of-concept modules, based on nanostructured bulk Mg2Si solid solutions. This class of TE material would have the following attractive characteristics: (i) ZT value >1.5 for both n-type and p-type doped material, (ii) operational in the temperature range 300-550ºC, (iii) very low density of 2 g/cm3, especially suitable for transportation applications, (iv) high melting point of >1000ºC, and good thermal stability up to 600ºC, (v) good oxidation and corrosion resistance and mechanical strength, (vi) isotropic thermoelectric properties, (vii) non-toxicity of elements, (viii) widely-available pure materials with very large EU supply chains and (ix) low raw material cost <15 Euros/kg, combined with low manufacturing costs. A number of methods will be looked at to achieve 3D bulk nanocrystalline Mg2Si including low-cost combustion synthesis, mechanical alloying and high-temperature solid-state synthesis in inert crucibles. Various ball milling approaches will be used to produce doped Mg2Si nanoparticle constituents that can then be compressed via rapid spark plasma sintering or hot pressing in vacuum. 3D nanocomposite material will also be produced with the addition or in-situ production of inert nanoparticles, as well as thin films using multilayer approaches. Doping using various elements will be predicted by ab-initio density-functional theory modelling. These methods will lead to the safe production of nanostructured n- and p-type legs for further thermoelectric and materials testing. In order to prove the concept works, demonstrator modules will be assembled that integrate the new energy-harvesting nanostructured material. Such modules have widespread applications in automotive, aerospace and manufacturing sectors, where waste heat can be usefully recovered, with clear environmental benefits.

Lab-on-chips (LOCs) are microsystems capable of manipulating small (micro to nanoliters) amounts of fluids in microfluidic channels with dimensions of tens to hundreds of micrometers: they have a huge application potential in many diverse fields, ranging from basic science (genomics and proteomics), to chemical synthesis and drug development, point-of-care medical analysis and environmental monitoring. Polymers are rapidly emerging as the material of choice for LOC production, due to the low substrate cost and ease of processing. Notwithstanding their potential, LOC commercial exploitation has been slow so far. Two breakthroughs that could promote LOC diffusion are: (i) a microfabrication technology with low-cost rapid prototyping capabilities; (ii) an integrated on-chip optical detection system. In this project we propose the use of femtosecond lasers as a novel highly flexible microfabrication platform for polymeric LOCs with integrated optical detection, for the realization of low-cost and truly portable biophotonic microsystems. Femtosecond laser processing is a direct, maskless fabrication technique enabling spatially selective three-dimensional material modification. It will be employed in different steps of the LOC production cycle: (i) rapid prototyping of the microfluidic chip using laser ablation or two-photon polymerization; (ii) direct fabrication of optical waveguides and integrated photonic components on the LOC for in situ optical sensing; (iii) master tool fabrication for mass production by replication techniques. The laser fabrication technology will enable to implement a variety of microfluidic LOCs with integrated photonic functionalities. In this project we concentrate on two prototypical applications in the fields of food quality and environmental sensing: LOCs for detection of mycotoxins in animal feeds and LOCs for water screening to detect bacteria and heavy ions contamination.

The vision of PilotManu is the upscale of the current mechanical alloying technological facility into a powder manufacturing pilot line by further developing existing IPR-covered results owned by the SMEs in the consortium related to mechanical alloying technology and to innovative powder materials for different applications. The baseline technology that will be upscaled from a technological facility status into pilot scale, is the High Energy Ball Milling machine, able to deliver innovative materials for new product lines developed by SMEs and industrial partnership that will lead the technological upscale. The project will demonstrate the technological and economical viability of the pilot line by implementing advanced materials into coatings, abrasive tool and additive manufacturing applications. Additional application sectors will be represented in the business cases by analyzing the cost/benefits of using the following new materials: Mg hydrides for hydrogen storage, thermoelectrics for energy harvesting, flame retardant textile and polymer nanocomposite for rapid prototyping. The potential impact brought by the new HEBM pilot production will be transversal also in all those technological sectors demanding high performance and outstanding material properties not achievable by conventional products. These huge un-exploited knowledge reservoir related to materials produced via HEBM or Mechanical Alloying will be unlocked by the Pilot Manu production system able to bring these results into the market.

The NaPANIL project aims to develop processes, materials and tools, both for manufacturing and for control, for truly 3-dimensional nanosurfaces with feature dimensions ranging from 50 nm to several m. The nanosurfaces will be realised using various variants of nanoimprinting lithography. The dedicated application is to control light at nanostructured surfaces and a few potential high impact products have been identified by the end-user partners in the consortium. Design, demonstration and prototyping these applications will act as test-bench for the new manufacturing paradigm. The manufacturing processes possess generic aspects for production of any kind of topographically 3-dimensional nanostructured surfaces. In the R&D of nanoimprinting Europe has a leading position. The NaPANIL consortium combines the best expertise and know how in field to reach the goals in the project.